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Copper Clad Laminates
Rigid PCB base materials including FR-4, CEM-1, CEM-3, halogen-free, and aluminum-based laminates.
Product comparison
| Product | Application overview | Process capabilities |
|---|---|---|
| Aluminum Base CCL | Metal core copper clad laminate for applications requiring stronger heat dissipation, board stability and thermal management support. | |
| CEM-1 / CEM-3 CCL | Economical copper clad laminate options for practical PCB production where cost control and stable routine performance are key priorities. | |
| FR-4 Copper Clad Laminate | Mainstream rigid PCB base material for stable electrical performance, broad process compatibility and industrial electronics manufacturing. | |
| High Tg / Halogen-Free / FR-5 CCL | Upgraded copper clad laminate options for customers requiring higher thermal reliability, compliance-oriented material choices and more demanding electronics performance. |
Category overview
Rigid PCB base materials including FR-4, CEM-1, CEM-3, halogen-free, and aluminum-based laminates.
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