Copper Clad Laminates
Aluminum Base CCL
Metal core copper clad laminate for applications requiring stronger heat dissipation, board stability and thermal management support.

Product details
Final specifications, performance, and supply scope are confirmed against the application requirements.
Metal core copper clad laminate for applications requiring stronger heat dissipation, board stability and thermal management support.
Product Summary
Metal core copper clad laminate for applications requiring stronger heat dissipation, board stability and thermal management support.
How to Select Between the Grades
Aluminum base copper clad laminate is used where heat management is part of the product requirement, not just electrical connection. It is especially suitable for overseas buyers in LED, power conversion and industrial electronics who need a thermally efficient PCB base material.
Material and Grade Overview
Material StructureCopper foil plus dielectric layer on aluminum base Key FeaturesHeat dissipation support, board rigidity and electrical insulation design Product FocusThermal-management PCB applications Supply StatusCustomizable
Available Grades and Dimensions
- Specification status: Customizable
- Board structure and size can be supplied according to thermal management application needs
- Available for project-based export supply in LED and power electronics fields
Typical Applications
- LED lighting boards and thermal-management electronic modules
- Power electronics, converters and industrial driver systems
- Projects requiring heat spreading performance beyond standard rigid PCB materials
- Customers needing a reliable export supply option for metal core board applications Copper Clad Laminates | Product overview
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